Features: with a aluminum copper clad better heat dissipation sex, especially suitable for high power, high heat dissipation requirements of the PCB production.
Metal grassroots: 1.0 mm; 1.5 mm; 2.0 mm; 3.0 mm
Copper foil: 1 oz; 2 oz; 3 oz; 4 oz; 6 oz Supply size: 1000 x600mm; 500 x600mm
|
Item |
Test Condition |
Desired value |
Test value |
|
（N/mm）
Peel Strength min |
A |
≥1.8 |
2.3 |
|
After thermal
stress |
2.0 |
|
Blister test After
Thermal stress |
A |
288℃2min
No delaminating |
OK |
|
After thermal
impact |
|
Flammability |
A |
FV-O |
FV-O |
|
Thermal resistance max |
A |
≤2.0 |
0.6 |
|
Surface Resistivity
min |
A |
≥2×105 |
3×106 |
|
Constant humidity treatment
(90%,35℃,96h) |
≥2×105 |
3.5×106 |
|
Volume Resistivity |
A |
≥2×106 |
2.8×107 |
|
(90%,35℃,96h) |
≥2×106 |
2.6×107 |
|
min
Dielectric Breakdown |
A |
≥2 |
5 |
|
（1MHz）
Dielectric constant At
1MHz max |
（40℃，90%，96h） |
≤4.4 |
2.4 |
|
（1MHz）
Dielectric dissipation
factor |
（40℃，90%，96h） |
≤0.03 |
0.028 |
|
Thermal-conductive Factor |
W/m·k |
≥2 |
2.2 | |
