2. Application:It is suitable for printed circuit boards that required high density and excellent heat resistance,it is also widely used for Mobile communication production, GSM, CDMA, 3G and so on. 4. Size: 1.2x0.55m,1.13x0.44m,1.030*0.44m,0.88x0.4mm, 0.88x0.51m, 0.88 x 0.55m, 0.66x0.44m, 0.6x0.5m, 0.51 x 0.51m,0.55 x 0.44m,0.4 x0. 44m,0.43 x 0.36m,0.3 x0.25m 5. Dielectric Constant:2.55,,2.65,2.75,2.85,2.95, 3.00, 3.3, 3.5 DF:0.0030 @ 10GHz 6. Operating temperature: -60±260℃ Heat Conduction Coefficient: 0.8 Kcal/m/hour °C Water absorption: ≤0.02 % |